WPE products are used worldwide in Communications, Military, Space, Aerospace and Medical markets.
Let WPE partner you to develop an INPAC Package to suit your needs.

Click here to view Typical INPAC material combinations
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  • WPE produces a series of hermetic packages having a range of properties to suit specific application requirements.
    Including Lightweight, High Efficiency and Thermal performance, to meet the demanding ever-changing needs of the microelectronics industry.
  • The INPAC products can be made from selective materials to match performance requirements dictated by the application.
  • INPAC packages can be designed for high frequency impedance matching, DC circuits or combinations of both.
  • INPAC packages can be hermetically lid sealed by resistance or laser welding and are compatible with industry standard sealing systems.
  • Materials can be designed to accommodate substrate and post substrate sub-assembly, a variety of interconnection technologies, including multi-cavity, and variable CTE configurations over a wide range of operationg temperatures to minimise induced thermal stresses.
  • INPAC packages can be supplied with various accoutrements, including laser sealed connectors, optical lens and glass windows.

Last modified: 11th November 2016